Building Better PCB and Electronics Components: Thermal Management using Ansys ICEPAK

Building Better PCB and Electronics Components: Thermal Management using Ansys ICEPAK

₹250.00

Last date of Registration:  23rd July, 2025

Out of stock

SKU: 26th July, 2025 Category:

Profile of the Instructor

Arindam Pal is an Application Engineer at CADFEM with over 4 years of experience in engineering simulation. He has done M.Tech in Mechanical Engineering with specialization in Thermal Engineering from KIIT. He specializes in ANSYS Fluent and Ansys ICEPAK, with a strong focus on Conjugate Heat Transfer (CHT), Internal & External flows and Electro-Thermal analysis. He facilitates adaption of CFD simulation in the different industry segments like Industrial Equipments, Automotive industry, Mechatronics, Healthcare Industry, Battery Systems, Drone and Aerospace and Defense.

Eligibility & Intended Audience

Eligibility : Students, researchers or working professionals who have either completed or pursuing an engineering degree. Having High School Math, Fundamentals of Heat and Mass Transfer or Fluid Dynamics would be helpful. Intended Audience : This workshop is designed for undergraduate and postgraduate students, as well as industrial R&D scientists, who are interested in Computational Fluid Dynamics and Electronics cooling.        

Fee for the Workshop

Fee- Rs. 295 (250+ 18% GST)  

Topics covered

Session details

Session Date: 26th July, 2025 Duration of the Workshop : 3 hrs Session time  : 04:00 p.m to 07:00 p.m.  

Pre - Requisite

Tools/software that will be used :  Ansys ICEPAK Students need to install the Ansys student version software before the workshop and can be downloaded from the below link https://www.ansys.com/en-in/academic/students/ansys-electronics-desktop-student

Certification

Attending the Workshop is mandatory to be eligible for the certification.

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