Electronics Thermal management using Ansys Icepak – Hands-on Workshop

Last day of registration: 1st February, 2023



SKU: | Start date: 4 February 2023 Category:


About the workshop:

Electronic devices today have smaller footprints and unique power requirements that call for superior thermal designs. Overheated components degrade product reliability, resulting in costly redesigns. To ensure adequate cooling of IC packages, printed circuit boards (PCBs) and complete electronic systems, engineers rely on ANSYS Icepak to validate thermal designs before building any hardware. Icepak combines advanced solver technology with robust, automatic meshing to enable you to rapidly perform heat transfer and fluid flow simulation for a wide variety of electronic applications — including computers, telecommunications equipment and semiconductor devices, as well as aerospace, automotive and consumer electronics.

Join this workshop to get a hands-on experience of using Ansys Icepak for Electronics thermal management.

Instructor : Mr. Rohit Sangwan, Senior Application Engineer, ARK Infosolutions Pvt. Ltd.



Session date : 4th February, 2023

Timings : Saturday 10am – 12pm

Mode of workshop: ONLINE

Registration fees and Certificate

Course Fee : Rs 236/- ( Rs 200 +18% GST)

Certificiate : Certificates will be provided to ONLY those participants who attend the workshop and 60% (time logged in attendance)  will be taken as a criterion for certification.


If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Founded in 1970 in USA, today Ansys is the global leader in engineering simulation. Engineering simulation is our sole focus. For more than 45 years, we have consistently advanced this technology to meet evolving customer needs. Ansys develops, markets, and supports engineering simulation software used to predict how product designs will behave in real-world environments.

We bundle our commercial software by physics area and work with universities to utilize our software in teaching and research and currently have more than 3,300 university customers in 95 countries. Our digital engagement strategy has evolved to include an “Access, Learn, Engage” model that is supported by our free student downloads, free Ansys Innovation Courses and Learning Forum that make it easy for learners to access our products, learn how to use them and ask questions to their peers and our experts. We also work to develop partnerships in areas like student team sponsorship, strategic curriculum and research opportunities and STEM. We recently released a free Electronics Desktop Product for Students that provides free online access to our industry-leading simulation solutions, including Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor and Ansys Icepak. This adds to our existing student products including Ansys Student, consisting of structures and fluids, Ansys LS-DYNA Student, Ansys Discovery Student and Ansys SCADE Student.


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